科研论文

发布时间:2015-04-15浏览次数:5

序号
论文题目
作者
发表
时间
刊物名称
类型
1
Research on Dynamic Forming of Chip’s Path in Virtual Reality Environment
谭光宇
2004
Key Engineering Materials
SCI
2
A Rise in Temperature by Moving Planar Sources of Heat on the Rake Face for the Waved-Edge Milling Inserts
谭光宇
2004
Key Engineering Materials
SCI
3
Study on groove Optimization Technology Based on the Power Spectrum Analysis
谭光宇
2004
IMCC, Materials Science Forum
SCI
4
Research on Adhesion Failure of Milling Insert and Mechanical- Thermal Coupled Field in Milling of Difficult- to-Cut Materials
谭光宇
2006
Materials Science Forum
SCI
EI
5
复杂槽型铣刀片三维温度场分析及其模糊评价
谭光宇
2004.3
机械工程学报,
EI
6
Study on 3D Temperature Distribution of Milling Insert with Complex Groove
谭光宇
2004.11
ASME IMECE2004-59962
Anaheim, California
EI
7
3D Stress Field Analysis and Fuzzy Comprehensive Evaluation for Milling Insert with Complex Groove
谭光宇
2004.12
(7th ICPMT)
EI
ISTP
8
Structured-Light Based on Shaped Depth-image Capturing System
谭光宇
2000.7
SPIE, Volume 4080
EI
ISTP
9
Design and implementation of rule-based visualized user interface
谭光宇
2000
SPIE,4192
EI
ISTP
10
Method of Mathematical Model’s Building and Calibration of Line Construction Light 3-D Measuring in Reverse Engineering
谭光宇
2004.12
7th ICPMT 国际会议
EI
ISTP
11
Assembly Sequence Planning based on Mating Liaison Graph
谭光宇
2000
5th ICPMT
ISTP
12
Molding and Real-time Simulation of Ocean-wave Signal
谭光宇
2001.11
5th International Conference on Electronic and Instruments
ISTP
13
Control of surface roughness of part of rapid prototyping of selected laser sintering
谭光宇
2003.8
MCGM 国际会议
ISTP
14
Pre-Processing of Data Points and Surface Reconstruction in RRE
谭光宇
2004.12
7th ICPMT 国际会议
EI
ISTP
15
Thermal Imaging Experimental Research on Temperature Field for Milling Insert
张玉华
2009.3
Key Engineering Materials
EI