序号 | 论文题目 | 作者 | 发表 时间 | 刊物名称 | 类型 |
1 | Research on Dynamic Forming of Chip’s Path in Virtual Reality Environment | 谭光宇 | 2004 | Key Engineering Materials | SCI |
2 | A Rise in Temperature by Moving Planar Sources of Heat on the Rake Face for the Waved-Edge Milling Inserts | 谭光宇 | 2004 | Key Engineering Materials | SCI |
3 | Study on groove Optimization Technology Based on the Power Spectrum Analysis | 谭光宇 | 2004 | IMCC, Materials Science Forum | SCI |
4 | Research on Adhesion Failure of Milling Insert and Mechanical- Thermal Coupled Field in Milling of Difficult- to-Cut Materials | 谭光宇 | 2006 | Materials Science Forum | SCI EI |
5 | 复杂槽型铣刀片三维温度场分析及其模糊评价 | 谭光宇 | 2004.3 | 机械工程学报, | EI |
6 | Study on 3D Temperature Distribution of Milling Insert with Complex Groove | 谭光宇 | 2004.11 | ASME IMECE2004-59962 Anaheim, California | EI |
7 | 3D Stress Field Analysis and Fuzzy Comprehensive Evaluation for Milling Insert with Complex Groove | 谭光宇 | 2004.12 | (7th ICPMT) | EI ISTP |
8 | Structured-Light Based on Shaped Depth-image Capturing System | 谭光宇 | 2000.7 | SPIE, Volume 4080 | EI ISTP |
9 | Design and implementation of rule-based visualized user interface | 谭光宇 | 2000 | SPIE,4192 | EI ISTP |
10 | Method of Mathematical Model’s Building and Calibration of Line Construction Light 3-D Measuring in Reverse Engineering | 谭光宇 | 2004.12 | 7th ICPMT 国际会议 | EI ISTP |
11 | Assembly Sequence Planning based on Mating Liaison Graph | 谭光宇 | 2000 | 5th ICPMT | ISTP |
12 | Molding and Real-time Simulation of Ocean-wave Signal | 谭光宇 | 2001.11 | 5th International Conference on Electronic and Instruments | ISTP |
13 | Control of surface roughness of part of rapid prototyping of selected laser sintering | 谭光宇 | 2003.8 | MCGM 国际会议 | ISTP |
14 | Pre-Processing of Data Points and Surface Reconstruction in RRE | 谭光宇 | 2004.12 | 7th ICPMT 国际会议 | EI ISTP |
15 | Thermal Imaging Experimental Research on Temperature Field for Milling Insert | 张玉华 | 2009.3 | Key Engineering Materials | EI |